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Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
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Authors
Sphabmixay, Kim
;
Van Olmen, Jan
;
Moon, Kwang Jin
;
Vanstreels, Kris
;
D'Haen, Jan
;
Tokei, Zsolt
;
List, S.
;
Beyer, Gerald
Issue
11
Journal
Microelectronic Engineering
Volume
84
Title
Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
Publication type
Journal article
Embargo date
9999-12-31
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