Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Conference contributions
View item
imec Publications Repository
imec Publications
Conference contributions
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off
Metadata
Show full item record
Authors
Dross, Frederic
;
Milhe, Aurelien
;
Robbelein, Jo
;
Gordon, Ivan
;
Bouchard, Pierre-Olivier
;
Beaucarne, Guy
;
Poortmans, Jef
Conference
23rd European Photovoltaic Energy Conference - EPVSEC
Title
SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off
Publication type
Proceedings paper
Collections
Conference contributions
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login