Authors

Reiche, M.; Moutanabbir, O.; Himcinschi, C.; Christiansen, S.; Erfurth, E.; Goesele, U.; Mantl, S.; Buca, D.; Zhao, Q. T.; Loo, Roger; Nguyen, Duy; Muster, F.; Petzold, M.

Conference

Semiconductor Wafer Bonding 10: Science, Technology, and Applications

Title

Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation

Publication type

Proceedings paper