Publication:
Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation
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1893 since deposited on 2021-10-17
2last week
Acq. date: 2025-10-28
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Metrics
Views
1893 since deposited on 2021-10-17
2last week
Acq. date: 2025-10-28
Citations