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Impact of the high-temperature process steps on the HfAIO interpoly dielectric stacks for nonvolatile memory applications

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1856 since deposited on 2021-10-17
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Acq. date: 2026-08-05

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1856 since deposited on 2021-10-17
2last month
1last week
Acq. date: 2026-08-05

Citations