Copper plating for 3d interconnects

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Authors
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe
Conference
Processing, Materials, and Integration of Damascene and 3D Interconnects
Title
Copper plating for 3d interconnects
Publication type
Proceedings paper
Embargo date
9999-12-31
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