Authors

Rosseel, Erik; Ortolland, Claude; Hikavyy, Andriy; Schram, Tom; Falepin, Annelies; Hoffmann, Thomas Y.; Douhard, Bastien; Moussa, Alain; Vandervorst, Wilfried; Ameen, Mike; Rubin, Leonard

Conference

18th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP

Title

Influence of the process sequence and termal budget on the strain of SiC stressor layers formed by ion implantation

Publication type

Proceedings paper

Embargo date

9999-12-31