Authors

Rosseel, Erik; Ortolland, Claude; Hikavyy, Andriy; Schram, Tom; Falepin, Annelies; Hoffmann, Thomas Y.; Vandervorst, Wilfried; Ameen, Mike; Rubin, Leonard

Conference

18th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP

Title

Influence of the process sequence and termal budget on the straion fof SiC stressor layers formed by Ion Implantation

Publication type

Meeting abstract