Authors

Yang, Yu; Labie, Riet; Ling, Fangzhou; Zhao, Chao; Radisic, Alex; Van Olmen, Jan; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid

ISSN

0026-2714

Issue

9_11

Journal

Microelectronics Reliability

Volume

50

Title

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures

Publication type

Journal article