Authors

Guo, Bin; Wen, Lianggong; Helin, Philippe; Claes, Gert; Verbist, Agnes; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; De Wolf, Ingrid; Shahar, Abdul Hadi; Li, Yunlong; Cui, Hushan; Lux, Marcel; Vereecke, Guy; Tilmans, Harrie; Haspeslagh, Luc; Decoutere, Stefaan; Osman, Haris; Puers, Bob; Severi, Simone; Witvrouw, Ann

Conference

IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS

Title

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers

Publication type

Proceedings paper

Embargo date

9999-12-31