Publication:
Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
Date
Loading...
Files
Journal
Abstract
Description
Metrics
Views
1876 since deposited on 2021-10-19
412item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1876 since deposited on 2021-10-19
412item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations