Publication:
Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
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1928 since deposited on 2021-10-21
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Acq. date: 2026-08-05
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Statistics
Views
1928 since deposited on 2021-10-21
2last month
2last week
Acq. date: 2026-08-05
Citations