Publication:
Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate
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1845 since deposited on 2021-10-21
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Acq. date: 2026-07-19
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Statistics
Views
1845 since deposited on 2021-10-21
2last month
2last week
Acq. date: 2026-07-19
Citations