Publication:
Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate
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1849 since deposited on 2021-10-21
6last month
1last week
Acq. date: 2026-08-09
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Statistics
Views
1849 since deposited on 2021-10-21
6last month
1last week
Acq. date: 2026-08-09
Citations