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In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
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Authors
Vanstreels, Kris
;
Czarnecki, Piotr
;
Kirimura, Tomoyuki
;
Siew, Yong Kong
;
Tokei, Zsolt
;
Boemmels, Juergen
;
Croes, Kristof
Conference
Materials for Advanced Metallization - MAM
Title
In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
Publication type
Meeting abstract
Embargo date
9999-12-31
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