Publication:
In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
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1864 since deposited on 2021-10-21
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Acq. date: 2026-02-27
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Statistics
Views
1864 since deposited on 2021-10-21
1last month
1last week
Acq. date: 2026-02-27
Citations