Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Wet clean in BEOL interconnect: Post etch residue removal and material compatibility
Publication:
Wet clean in BEOL interconnect: Post etch residue removal and material compatibility
Date
2014
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kesters, Els
;
Le, Quoc Toan
;
Yu, David
;
Shen, Mary
;
Braun, Simon
;
Klipp, Andreas
;
Holsteyns, Frank
Journal
Abstract
Description
Metrics
Views
1883
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations
Metrics
Views
1883
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations