Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Publication:
Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Copy permalink
Date
2014
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Matovu, John B.
;
Ong, Patrick
;
Teugels, Lieve
;
Leunissen, Peter
;
Babu, S. V.
Journal
Microelectronic Engineering
Abstract
Description
Metrics
Views
1894
since deposited on 2021-10-22
2
last month
Acq. date: 2026-01-09
Citations
Metrics
Views
1894
since deposited on 2021-10-22
2
last month
Acq. date: 2026-01-09
Citations