Authors

Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Maggioni, Federica; De Vos, Joeri; Wang, Teng; Daily, Robert; Beyne, Eric

Conference

IEEE Electronic Components & Technology Conference - ECTC

Title

Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

Publication type

Proceedings paper

Embargo date

9999-12-31