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Conference contributions
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
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Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
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Date
2015-05
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Maggioni, Federica
;
De Vos, Joeri
;
Wang, Teng
;
Daily, Robert
;
Beyne, Eric
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1960
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Acq. date: 2025-12-11
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Views
1960
since deposited on 2021-10-22
3
last month
3
last week
Acq. date: 2025-12-11
Citations