Publication:

Thermal stability concern of metal-insulator-semiconductor contact: a case study of Ti/TiO2/n-Si contact

Date

2016
Journal article
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33729.pdf 2.77 MB

Author(s)

Yu, Hao  
;
Schaekers, Marc  
;
Schram, Tom  
;
Demuynck, Steven  
;
Horiguchi, Naoto  
;
Barla, Kathy  
;
Collaert, Nadine  
;
Thean, Aaron  
;
De Meyer, Kristin  

Journal

IEEE Transactions on Electron Devices

Abstract

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