Cu passivation for integration of gap-filling ultralow-k dielectrics

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Author(s)

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de Marneffe, Jean-Francois

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Lesniewska, Alicja

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Verdonck, Patrick

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Boemmels, Juergen

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De Gendt, Stefan

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Baklanov, Mikhail

Journal

Applied Physics Letters

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1969 since deposited on 2021-10-23

Acq. date: 2025-10-24