Publication:
FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3
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2064 since deposited on 2021-10-29
2last month
Acq. date: 2026-02-25
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Statistics
Views
2064 since deposited on 2021-10-29
2last month
Acq. date: 2026-02-25
Citations