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dc.contributor.authorKeulemans, Grim
dc.contributor.authorLiang, Boshen
dc.contributor.authorPodkovskiy, Alexey
dc.contributor.authorJambaldinni, Shruti
dc.contributor.authorWysocka, Dominika
dc.contributor.authorZhang, Lei
dc.contributor.authorStakenborg, Tim
dc.contributor.authorCheyns, David
dc.contributor.authorHeremans, Paul
dc.contributor.authorRochus, Veronique
dc.date.accessioned2022-05-31T07:42:38Z
dc.date.available2021-11-02T15:55:10Z
dc.date.available2022-05-31T07:42:38Z
dc.date.issued2021-04-26
dc.identifier.issnNone
dc.identifier.otherWOS:000706452600017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37435.2
dc.sourceWOS
dc.titleTransient pull-in simulation of electrostatic microvalve with physics-based contact function
dc.typeProceedings paper
dc.contributor.imecauthorKeulemans, Grim
dc.contributor.imecauthorLiang, Boshen
dc.contributor.imecauthorPodkovskiy, Alexey
dc.contributor.imecauthorJambaldinni, Shruti
dc.contributor.imecauthorWysocka, Dominika
dc.contributor.imecauthorZhang, Lei
dc.contributor.imecauthorStakenborg, Tim
dc.contributor.imecauthorCheyns, David
dc.contributor.imecauthorHeremans, Paul
dc.contributor.imecauthorRochus, Veronique
dc.contributor.orcidimecKeulemans, Grim::0000-0001-6896-7275
dc.contributor.orcidimecLiang, Boshen::0000-0003-3299-9034
dc.contributor.orcidimecStakenborg, Tim::0000-0001-9878-9078
dc.contributor.orcidimecCheyns, David::0000-0002-1327-8752
dc.contributor.orcidimecHeremans, Paul::0000-0003-2151-1718
dc.contributor.orcidimecPodkovskiy, Alexey::0000-0002-3050-5347
dc.contributor.orcidimecWysocka, Dominika::0000-0001-5056-6502
dc.contributor.orcidimecRochus, Veronique::0000-0001-9680-5724
dc.contributor.orcidimecJambaldinni, Shruti::0000-0003-3925-2726
dc.contributor.orcidimecZhang, Lei::0000-0002-7405-6352
dc.identifier.doi10.1109/EuroSimE52062.2021.9410843
dc.identifier.eisbn978-1-6654-1373-2
dc.source.numberofpages5
dc.source.peerreviewno
dc.source.conference22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.conferencedateAPR 19-22, 2021
dc.source.conferencelocationSt. Julian, Malta
dc.source.journal2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
imec.availabilityUnder review


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