dc.contributor.author | Keulemans, Grim | |
dc.contributor.author | Liang, Boshen | |
dc.contributor.author | Podkovskiy, Alexey | |
dc.contributor.author | Jambaldinni, Shruti | |
dc.contributor.author | Wysocka, Dominika | |
dc.contributor.author | Zhang, Lei | |
dc.contributor.author | Stakenborg, Tim | |
dc.contributor.author | Cheyns, David | |
dc.contributor.author | Heremans, Paul | |
dc.contributor.author | Rochus, Veronique | |
dc.date.accessioned | 2022-06-24T07:56:27Z | |
dc.date.available | 2021-11-02T15:55:10Z | |
dc.date.available | 2022-05-31T07:42:38Z | |
dc.date.available | 2022-06-24T07:56:27Z | |
dc.date.issued | 2021-04-26 | |
dc.identifier.issn | None | |
dc.identifier.other | WOS:000706452600017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37435.3 | |
dc.source | WOS | |
dc.title | Transient pull-in simulation of electrostatic microvalve with physics-based contact function | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Keulemans, Grim | |
dc.contributor.imecauthor | Liang, Boshen | |
dc.contributor.imecauthor | Podkovskiy, Alexey | |
dc.contributor.imecauthor | Jambaldinni, Shruti | |
dc.contributor.imecauthor | Wysocka, Dominika | |
dc.contributor.imecauthor | Zhang, Lei | |
dc.contributor.imecauthor | Stakenborg, Tim | |
dc.contributor.imecauthor | Cheyns, David | |
dc.contributor.imecauthor | Heremans, Paul | |
dc.contributor.imecauthor | Rochus, Veronique | |
dc.contributor.orcidimec | Keulemans, Grim::0000-0001-6896-7275 | |
dc.contributor.orcidimec | Liang, Boshen::0000-0003-3299-9034 | |
dc.contributor.orcidimec | Stakenborg, Tim::0000-0001-9878-9078 | |
dc.contributor.orcidimec | Cheyns, David::0000-0002-1327-8752 | |
dc.contributor.orcidimec | Heremans, Paul::0000-0003-2151-1718 | |
dc.contributor.orcidimec | Podkovskiy, Alexey::0000-0002-3050-5347 | |
dc.contributor.orcidimec | Wysocka, Dominika::0000-0001-5056-6502 | |
dc.contributor.orcidimec | Rochus, Veronique::0000-0001-9680-5724 | |
dc.contributor.orcidimec | Jambaldinni, Shruti::0000-0003-3925-2726 | |
dc.contributor.orcidimec | Zhang, Lei::0000-0002-7405-6352 | |
dc.identifier.doi | 10.1109/EuroSimE52062.2021.9410843 | |
dc.identifier.eisbn | 978-1-6654-1373-2 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | no | |
dc.source.conference | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
dc.source.conferencedate | APR 19-22, 2021 | |
dc.source.conferencelocation | St. Julian, Malta | |
dc.source.journal | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
imec.availability | Published - open access | |