Publication:

Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs

Date

2021
Proceedings Paper
https://doi.org/10.1109/islped52811.2021.9502475
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islped21anthony.pdf 1.22 MB

Author(s)

Agnesina, Anthony
;
Brunion, Moritz
;
Kim, Jinwoo
;
Garcia-Ortiz, Alberto
;
Milojevic, Dragomir  
;
Catthoor, Francky  
;
Perumkunnil, Manu  
;
Lim, Sung Kyu

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na

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237 since deposited on 2021-11-02
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