Publication:

Development of compression molding process for Fan-Out wafer level packaging

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00306

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Author(s)

Bertheau, Julien

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Kubota, Tadashi

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Phommahaxay, Alain

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Journal

na

Statistics

1873 since deposited on 2021-11-02

Acq. date: 2026-04-06