Publication:
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
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1818 since deposited on 2021-11-02
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Acq. date: 2026-08-04
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Statistics
Views
1818 since deposited on 2021-11-02
2last month
2last week
Acq. date: 2026-08-04
Citations