Browsing Conference contributions by imec author "23f367559dd9031027f0efe03c529218ea9006a9"
Now showing items 21-40 of 80
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Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Z.; Rivera, K.; Van der Plas, Geert; Pawlak, Bartek; England, L.; Beyne, Eric; Baelmans, M. (2020) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Determining the thermal behaviour of encapsulants and its impact on energy yield
El-Chami, Ibrahim; Oprins, Herman; Cherman, Vladimir; Horvath, Imre T; Goverde, Hans; Govaerts, Jonathan; Borgers, Tom; Voroshazi, Eszter; Poortmans, Jef (2018) -
Die thickness impact on thermo-mechanical stress in 3D packages
Salahouelhadj, Abdellah; Gonzalez, Mario; Oprins, Herman (2015) -
Digital and continuous liquid cooling for electronic systems
Baelmans, Martine; Oprins, Herman; Stevens, Tine; Rogiers, Frederik (2007-04) -
Distributed electro-thermal model based on fast and scalable algorithm for GaN power devices and circuit simulations
Sodan, Vice; Oprins, Herman; Stoffels, Steve; Baelmans, Martine; Decoutere, Stefaan; De Wolf, Ingrid (2017-05) -
Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application
Chen, Caroline; Oprins, Herman; Vandevelde, Bart; Brizar, Guy; Vanderstraeten, Daniel; Blansaer, Eddy (2005-09) -
Electromigration activation energies in ruthenium interconnects
Beyne, Sofie; Varela Pedreira, Olalla; Oprins, Herman; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2019) -
Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C.; Christiaens, W.; Vanfleteren, Jan (2007) -
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Srinivasan, Adi; Cupak, Miroslav; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Edmund (2010-10) -
Experimental characterization of the vertical and lateral heat transfer in 3D-SIC packages
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Beyne, Eric (2015-07) -
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Maggioni, Federica; De Vos, Joeri; Wang, Teng; Daily, Robert; Beyne, Eric (2015-05) -
Fabrication of an electrostatically actuated impingement cooling device
Majeed, Bivragh; Oprins, Herman; Vandevelde, Bart; Sabuncuoglu Tezcan, Deniz; Fiorini, Paolo (2011) -
Fine grain thermal modeling of 3D stacked structures
Oprins, Herman; Cupak, Miroslav; Van der Plas, Geert; Vandevelde, Bart; Marchal, Pol; Srinivasan, Adi; Cheng, Edmund (2009-10) -
First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Wei, Tiwei; Oprins, Herman; Beyne, Eric; Cherman, Vladimir; De Wolf, Ingrid; Baelmans, Martine (2019-05) -
First-principles 3D thermal simulation of microscale devices
Vermeersch, Bjorn; Mingo, Natalio; Bury, Erik; Pourtois, Geoffrey; Oprins, Herman; Nejim, Ahmed (2017) -
GaN technology on high-resistivity Si-substrates for high-power-amplifiers
Das, Jo; Derluyn, Joff; Lorenz, Anne; Oprins, Herman; Xiao, Dongping; De Raedt, Walter; Cheng, Kai; Leys, Maarten; Degroote, Stefan; Germain, Marianne; Borghs, Gustaaf (2008) -
Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
Oprins, Herman; Beyne, Eric (2014-05) -
High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Baelmans, Martine (2017) -
High heat flux dissipation via interposer active micro-cooling
Buja, Federico; Zhang, Lei; Cherman, Vladimir; Oprins, Herman; Jones, Ben; Soussan, Philippe (2018)