Browsing Conference contributions by imec author "23f367559dd9031027f0efe03c529218ea9006a9"
Now showing items 41-60 of 80
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High heat flux removal using optimized microchannel heat sink
Zhang, Lei; Jones, Ben; Buja, Federico; Cherman, Vladimir; Oprins, Herman; Soussan, Philippe (2018) -
Impact of FEOL cross heating on the thermal performance of advanced BEOL
Lofrano, Melina; Vermeersch, Bjorn; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2022) -
Interconnect metals beyond copper: reliability challenges and opportunities
Croes, Kristof; Adelmann, Christoph; Wilson, Chris; Zahedmanesh, Houman; Varela Pedreira, Olalla; Wu, Chen; Lesniewska, Alicja; Oprins, Herman; Beyne, Sofie; Ciofi, Ivan; Kocaay, Deniz; Stucchi, Michele; Tokei, Zsolt (2018) -
Joule heating investigation for advanced interconnect schemes with airgaps
Lofrano, Melina; Varela Pedreira, Olalla; Ciofi, Ivan; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2021) -
Layout-optimization of power-devices
Vanaverbeke, Fre; Das, Jo; Oprins, Herman; Derluyn, Joff; Germain, Marianne; De Raedt, Walter (2009) -
Methods to measure mechanical properties of NEMS and MEMS: challenges and pitfalls
De Wolf, Ingrid; Kalicinski, Stanislaw; De Coster, Jeroen; Oprins, Herman (2009) -
Modeling, design and fabrication of a novel electrowetting based impingement cooler
Oprins, Herman; Fiorini, Paolo; De Vos, Joeri; Majeed, Bivragh; Vandevelde, Bart; Beyne, Eric (2010-11) -
Nanoscale simulation of self heating and thermal crosstalk in 3D finFET architectures
Vermeersch, Bjorn; Bury, Erik; Croes, Kristof; Oprins, Herman; Kamrani, Hamed; Pourtois, Geoffrey (2019) -
New fast distributed thermal model for analysis of GaN based power devices
Sodan, Vice; Maggioni, Federica; Oprins, Herman; Stoffels, Steve; Baelmans, Martine; De Wolf, Ingrid (2016) -
Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Baelmans, Martine (2018) -
Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack
Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2012-05) -
Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts
Oprins, Herman; Badaroglu, Mustafa; Vandevelde, Bart; Gonzalez, Mario; Van der Plas, Geert; Beyne, Eric (2013-05) -
Practical chip-centric electro-thermal simulations
Gillon, Renaud; Joris, Patricia; Oprins, Herman; Vandevelde, Bart; Srinivasan, Adi; Chandra, Rajit (2008-09) -
Preliminary Study on Hybrid Manufacturing of the Electrical-Mechanical Integrated Systems (EMIS) Assisted by the LCD Stereolithography Technology
Fei, Guanghai; Wei, Tiwei; Qimin, Shi; Guo, Yongjian; Oprins, Herman; Yang, Shoufeng (2019) -
Selective cooling of microelectronics using electrostatic actuated liquid droplets - modelling and experiments
Oprins, Herman; Vandevelde, Bart; Beyne, Eric; Borghs, Gustaaf; Baelmans, Martine (2004) -
Self-heating assesment of GaN DHFETs using mono-lithically fabricated 2-DEG resistors
Srivastava, Puneet; Das, Jo; Oprins, Herman; Van Hove, Marleen; Marcon, Denis; Cheng, Kai; Leys, Maarten; Decoutere, Stefaan; Mertens, Robert; Borghs, Gustaaf (2010) -
Si trench around drain (STAD) technology of GaN-DHFETs on Si substrate for boosting power performance
Srivastava, Puneet; Oprins, Herman; Van Hove, Marleen; Das, Jo; Malinowski, Pawel; Bakeroot, Benoit; Marcon, Denis; Visalli, Domenica; Kang, Xuanwu; Lenci, Silvia; Geens, Karen; Viaene, John; Cheng, Kai; Leys, Maarten; De Wolf, Ingrid; Decoutere, Stefaan; Mertens, Robert; Borghs, Gustaaf (2011) -
Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips
Oprins, Herman; Cherman, Vladimir; Stucchi, Michele; Vandevelde, Bart; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2011-03) -
Temperature dependent electrical characteristics of through-si-via (TSV) interconnections
Katti, Guruprasad; Mercha, Abdelkarim; Stucchi, Michele; Tokei, Zsolt; Velenis, Dimitrios; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Oprins, Herman; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
Minas, Nikolaos; Van der Plas, Geert; Oprins, Herman; Yang, Yu; Okoro, Chukwudi; Mercha, Abdelkarim; Torregiani, Cristina; Perry, Dan; Marchal, Pol; Rakowski, Michal; Cherman, Vladimir (2010)