Browsing Conference contributions by author "Wagenleiter, Thomas"

Now showing items 1-2 of 2

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2016)
Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications

De Vos, Joeri; Peng, Lan; Van Ongeval, Joost; Phommahaxay, Alain; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2017)