Browsing Conference contributions by imec author "3519f96ac85d2e89287afdab586b96bb73f6d988"
Now showing items 1-7 of 7
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Defect localization in 3-D TSV structures by differential light-induced capacitance alteration
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration
Jacobs, Kristof J.P.; Kim, Soon-Wook; De Wolf, Ingrid; Beyne, Eric (2020) -
Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid (2016) -
Light-induced capacitance alteration for non-destructive open failure localization in 3-D TSV structures
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
Jacobs, Kristof J.P.; Li, Yunlong; Van Huylenbroeck, Stefaan; De Wolf, Ingrid; Beyne, Eric (2019) -
Open defect localization in 1x5 $lm 3-D TSV structures by Light-Induced Capacitance Alteration (LICA)
Jacobs, Kristof J.P.; De Vos, Joeri; Stucchi, Michele; De Wolf, Ingrid; Beyne, Eric (2018) -
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Koegel, Michael; Brand, Sebastian; Grosse, Christian; Jacobs, Kristof J.P.; De Wolf, Ingrid; Altmann, Frank (2021)