Browsing Conference contributions by imec author "761009bd205bb07de35d28813bd9a8882c9653ff"
Now showing items 1-20 of 41
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A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2012) -
A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
Mandamparambil, Rajesh; Fledderus, Henri; van den Brand, Jeroen; Saalmink, Milan; Kusters, Roel; Podprocky, Tomas; Van Steenberge, Geert; De Baets, Johan; Dietzel, Andreas (2009) -
A new approach of flip chip on board technology using SMT compatible processes
Zhang, S.; De Baets, Johan; Van Calster, Andre (1999) -
A parallel optical interconnect link with on-chip optical access
Bockstaele, Ronny; De Wilde, Michiel; Meeus, Wim; Rits, Olivier; Lambrecht, Hannes; Van Campenhout, Jan; De Baets, Johan; Van Daele, Peter; Van den Berg, Eric; Klemenc, Michaela; Eitel, Sven; Annen, Richard; Van Koetsem, Jan; Widawski, Gilles; Goudeau, Jacques; Bareel, Baudouin; Le Moine, Patrick; Fries, Reto; Straub, Peter; Marion, François; Routin, Julien; Baets, Roel (2004) -
A poly-CDSe active matrix for PNLC projection displays
Carchon, Nadine; Van Doorselaer, Geert; De Cubber, A. M.; De Baets, Johan; Van Calster, Andre; Candry, P.; Bruggeman, Jef (1997) -
a-SiN:H thin film diode for digital radiography
Popov, I.; Van Doorselaer, Geert; Van Calster, Andre; De Smet, Herbert; De Baets, Johan; Callens, F.; Boesman, E. (2001) -
Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2013) -
Advanced substrates and packages for wearable electronics and sensors
Vanfleteren, Jan; De Smet, Herbert; De Baets, Johan; Van Calster, Andre (2007-03) -
An Artificial Iris ASIC with High Voltage Liquid Crystal Driver, 10 nA Light Range Detector and 40 nA Blink Detector for LCD flicker removal
Raducanu, Bogdan; Asl, Samira Zali; Stanzione, Stefano; van Liempd, Chris; Vasquez Quintero, Andres; De Smet, Herbert; De Baets, Johan; Van Hoof, Chris; Van Helleputte, Nick (2020) -
An O/E measurement probe based on an optics-extended MCM-D motherboard technology
De Pauw, Herbert; De Baets, Johan; Vanfleteren, Jan; Van Calster, Andre (2002) -
Chip-to-chip parallel optical interconnects over optical backpanels based on arrays of multimode waveguides
Bockstaele, Ronny; De Wilde, Michiel; Meeus, Wim; Sergeant, Hendrik; Rits, Olivier; Van Campenhout, Jan; De Baets, Johan; Van Daele, Peter; Dorgeuille, François; Eitel, Sven; Klemenc, Michaela; Annen, Richard; Van Koetsem, Jan; Goudeau, Jacques; Bareel, Baudouin; Fries, Reto; Straub, Peter; Marion, François; Routin, Julien; Baets, Roel (2004) -
Cost modelling for embedded component technology
De Baets, Johan; Willems, Geert; Ostmann, A.; Kriechbaum, A.; Kostner, H. (2007-06) -
Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
Vanfleteren, Jan; De Baets, Johan; Van Calster, Andre; Schols, G.; Pergoot, N.; Järvinen, E.; Aintila, A. (1999) -
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask
Siau, Sam; Degrendele, Lieven; De Baets, Johan; Van Calster, Andre (2003) -
Embedded passive components for improved power plane decoupling
Cauwe, Maarten; De Baets, Johan; Grivon, Arnaud; Stahr, Johannnes; Amedeo, Alexandre (2014) -
FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers
Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Li, Changzheng; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; Mader, Lothar; Vanhaverbeke, Celine; O'Callaghan, John; Braeken, Dries; Andrei, Alexandru; Firrincieli, Andrea; Ballini, Marco; Kundu, Aritra; Fahmy, Ahmed; Patrick, Erin; Maghari, Nima; Bashirullah, Rizwan; De Baets, Johan (2019) -
Flexible and stretchable circuit technologies for space applications
Cauwe, Maarten; Bossuyt, Frederick; De Baets, Johan; Vanfleteren, Jan (2014) -
Flexible and stretchable electronics for wearable healthcare
van den Brand, Jeroen; de Kok, Margreet; Sridhar, Ashok; Cauwe, Maarten; Verplancke, Rik; Bossuyt, Frederick; De Baets, Johan; Vanfleteren, Jan (2014) -
Flexible implantable ultrathin chip encapsulation (FITEP) to fabricate neural CMOS-based probes for intra-fascicular implantation
Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; O'Callaghan, John; Braeken, Dries; Ballini, Marco; Bashirullah, Rizwan; De Baets, Johan (2017) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04)