Browsing Conference contributions by imec author "cfb1d453c9ffc569bbfa7ee454af721b0d339986"
Now showing items 1-7 of 7
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Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
Montero Alvarez, Daniel; Vega Gonzalez, Victor; Feurprier, Yannick; Varela Pedreira, Olalla; Oikawa, Noriaki; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Versluijs, Janko; De Coster, Hanne; Bazzazian, Nina; Jourdan, Nicolas; Kumar, Kaushik; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2022-06-29) -
Etch challenges in high aspect ratio aupervia patterning
Puliyalil, Harinarayanan; Feurprier, Yannick; Briggs, Basoene; Lazzarino, Frederic; Wilson, Chris; Kumar, Kaushik (2019) -
High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond
Puliyalil, Harinarayanan; Feurprier, Yannick; Oikawa, Noriaki; Vega Gonzalez, Victor; Briggs, Basoene; Montero Alvarez, Daniel; Lazzarino, Frederic; Tokei, Zsolt; Satoru, Nakamura; Tahara, Shigeru; Kumar, Kaushik (2021) -
Intra-field etch induced overlay penalties
van Haren, Richard; Yildirim, Oktay; Mouraille, Orion; van Dijk, Leon; Kumar, Kaushik; Feurprier, Yannick; Hermans, Jan (2020) -
On product overlay characterization after stressed layer etch
van Haren, Richard; Mouraille, Orion; Yildirim, Oktay; Van Dijk, Leon; Kumar, Kaushik; Feurprier, Yannick; Hermans, Jan (2021) -
Recent advances in EUV patterning in preparation towards high-NA EUV
Nagahara, Seiji; Dauendorffer, Arnaud; Thiam, Arame; Liu, Xiang; Kuwahara, Yuhei; Dinh, Cong Que; Okada, Soichiro; Kawakami, Shinichiro; Genjima, Hisashi; Nagamine, Noriaki; Muramatsu, Makoto; Shimura, Satoru; Tsuboi, Atsushi; Nafus, Kathleen; Feurprier, Yannick; Demand, Marc; Ramaneti, Rajesh; Foubert, Philippe; De Simone, Danilo; Vandenberghe, Geert (2023) -
Tone reversal technology development targeting below 5nm technology node applications
Decoster, Stefan; Lazzarino, Frederic; Piao, Xiaoyu; Feurprier, Yannick; Rassoul, Nouredine; Piumi, Daniele (2017)