Recently added

Ultrathin biocompatible implantable chip for bidirectional communication with peripheral nerves

Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; O'Callaghan, John; Braeken, Dries; Andrei, Alexandru; Firrincieli, Andrea; Ballini, Marco; Kundu, Aritra; Fahmy, Ahmed; Patrick, Erin; Maghari, Nima; Bashirullah, Rizwan; De Baets, Johan (2017)

The synergy of AFM and SIMS for advanced characterization of Li-ion battery cathodes

Op de Beeck, Jonathan; Celano, Umberto; Labyedh, Nouha; Sepulveda Marquez, Alfonso; Spampinato, Valentina; Franquet, Alexis; Vereecken, Philippe; Koenraad, Paul; Vandervorst, Wilfried (2017)

Analysis, design and implementation of secure LoRaWAN sensor networks

Oniga, Bogdan; Dadarlat, Vasile; De Poorter, Eli; Munteanu, Adrian (2017)

A secure LoRaWAN sensor network architecture

Oniga, B.; Dadarlat, V.; De Poorter, Eli; Munteanu, Adrian (2017-10)

Personalized robotic intervention strategy by using semantics for people with dementia in nursing homes

Ongenae, Femke; De Backere, Femke; Mahieu, Christof; De Pestel, Stijn; Nelis, Jelle; Simoens, Pieter; De Turck, Filip (2017-05)

Low temperature influence on long channel STI last process relaxed and strained Ge pFinFETs

Oliveira, Alberto; Agopian, Paula; Martino, Joao; Simoen, Eddy; Mitard, Jerome; Witters, Liesbeth; Collaert, Nadine; Claeys, Cor (2017)

High lateral electric field impact on the performance of Si-platform-based Ge pFinFETs

Oliveira, Alberto; Agopian, Paula GD; Martino, Joao Antonio; Simoen, Eddy; Mitard, Jerome; Witters, Liesbeth; Collaert, Nadine; Claeys, Cor (2017)

Experimental comparison between relaxed and strained Ge pFinFETs

Oliveira, Alberto; Agopian, P.G.D.; Martino, Joao A.; Simoen, Eddy; Mitard, Jerome; Witters, Liesbeth; Collaert, Nadine; Claeys, Cor (2017)

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Okudur, Oguzhan Orkut; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Zahedmanesh, Houman; Varela Pedreira, Olalla; Kim, Soon-Wook; Vanstreels, Kris; Beyne, Eric; De Wolf, Ingrid (2017)

Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element

Ohashi, Takeyoshi; Yamaguchi, Atsuko; Hasumi, Kazuhisa; Inoue, Osamu; Ikota, Masami; Lorusso, Gian; Donadio, Gabriele Luca; Yasin, Farrukh; Rao, Siddharth; Kar, Gouri Sankar (2017)

3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB

Ohashi, Takeyoshi; Yamaguchi, Atsuko; Hasumi, Kazuhisa; Ikota, Masami; Tan, Chi Lim; Raymaekers, Tom; Van den Bosch, Geert; Furnemont, Arnaud; Lorusso, Gian (2017)

Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element

Ohashi, Takeyoshi; Yamaguchi, Atusko; Hasumi, Kazuhisa; Inoue, Osamu; Ikata, Masami; Lorusso, Gian; Donadio, Gabriele Luca; Yasin, Farrukh; Rao, Siddharth; Kar, Gouri Sankar (2017)

Conference contributions: Recent submissions

Ultrathin biocompatible implantable chip for bidirectional communication with peripheral nerves

The synergy of AFM and SIMS for advanced characterization of Li-ion battery cathodes

Analysis, design and implementation of secure LoRaWAN sensor networks

A secure LoRaWAN sensor network architecture

Personalized robotic intervention strategy by using semantics for people with dementia in nursing homes

Low temperature influence on long channel STI last process relaxed and strained Ge pFinFETs

High lateral electric field impact on the performance of Si-platform-based Ge pFinFETs

Experimental comparison between relaxed and strained Ge pFinFETs

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element

3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB

Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element

ALD aluminum oxide as a hole selective tunneling contact for crystalline silicon solar cells

Impact of hydrogen peroxide in ultrapure water

How unique is your .onion? An analysis of the fingerprintability of Tor onion services

Occlusion robust symbol level fusion for multiple people tracking

Nanoscale stress measurements through advanced Raman spectroscopy

Authentic execution of distributed event-driven applications with a small TCB

Failure probability of a FinFET-based SRAM cell utilizing the most probable failure point

Thermo-mechanical finite element simulation of a sub-cell utilising wire interconnection

Conference contributions: Recent submissions

Ultrathin biocompatible implantable chip for bidirectional communication with peripheral nerves ﻿

The synergy of AFM and SIMS for advanced characterization of Li-ion battery cathodes ﻿

Analysis, design and implementation of secure LoRaWAN sensor networks ﻿

A secure LoRaWAN sensor network architecture ﻿

Personalized robotic intervention strategy by using semantics for people with dementia in nursing homes ﻿

Low temperature influence on long channel STI last process relaxed and strained Ge pFinFETs ﻿

High lateral electric field impact on the performance of Si-platform-based Ge pFinFETs ﻿

Experimental comparison between relaxed and strained Ge pFinFETs ﻿

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits ﻿

Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element ﻿

3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB ﻿

Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element ﻿

ALD aluminum oxide as a hole selective tunneling contact for crystalline silicon solar cells ﻿

Impact of hydrogen peroxide in ultrapure water ﻿

How unique is your .onion? An analysis of the fingerprintability of Tor onion services ﻿

Occlusion robust symbol level fusion for multiple people tracking ﻿

Nanoscale stress measurements through advanced Raman spectroscopy ﻿

Authentic execution of distributed event-driven applications with a small TCB ﻿

Failure probability of a FinFET-based SRAM cell utilizing the most probable failure point ﻿

Thermo-mechanical finite element simulation of a sub-cell utilising wire interconnection ﻿

Ultrathin biocompatible implantable chip for bidirectional communication with peripheral nerves

The synergy of AFM and SIMS for advanced characterization of Li-ion battery cathodes

Analysis, design and implementation of secure LoRaWAN sensor networks

A secure LoRaWAN sensor network architecture

Personalized robotic intervention strategy by using semantics for people with dementia in nursing homes

Low temperature influence on long channel STI last process relaxed and strained Ge pFinFETs

High lateral electric field impact on the performance of Si-platform-based Ge pFinFETs

Experimental comparison between relaxed and strained Ge pFinFETs

Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element

3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB

Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element

ALD aluminum oxide as a hole selective tunneling contact for crystalline silicon solar cells

Impact of hydrogen peroxide in ultrapure water

How unique is your .onion? An analysis of the fingerprintability of Tor onion services

Occlusion robust symbol level fusion for multiple people tracking

Nanoscale stress measurements through advanced Raman spectroscopy

Authentic execution of distributed event-driven applications with a small TCB

Failure probability of a FinFET-based SRAM cell utilizing the most probable failure point

Thermo-mechanical finite element simulation of a sub-cell utilising wire interconnection