Recently added

Cost components for 3D system integration

Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014)

Spin torque majority gates: operating conditions and a new design for enhanced reliability

Vaysset, Adrien; Nikonov, Dmitri E.; Young, Ian A.; Pourtois, Geoffrey; Sayan, Safak; De Boeck, Jo; Min, Tai; Thean, Aaron; Radu, Iuliana (2014)

Interplay between metallization and strain relaxation in epitaxial GeSn layers

Vantomme, Andre; Santos, N.; Van Stiphout, K.; Nakatsuka, Osamu; Masaki, A.; Shimura, Yosuke; Loo, Roger; Zaima, Shigeaku; De Tavernier, C,; Temst, Kristiaan; Comrie, C. M. (2014)

Advanced experimental BEOL stability test: measurements and simulations

Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2014)

On the impact of dopants and Si structure dimensions on {113}-defect formation during in-situ 2 MeV electron-irradiation in an UHVEM

Vanhellemont, Jan; Anada, Satoshi; Nagase, Takeshi; Yasuda, H.; Schulze, Andreas; Bender, Hugo; Rooyackers, Rita; Vandooren, Anne (2014)

Ultra high voltage electron microscoy study of {113}-defect generation in Si nanowires

Vanhellemont, Jan; Anada, S.; Nagase, T.; Yasuda, H.; Bender, Hugo; Rooyackers, Rita; Vandooren, Anne (2014)

Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies

Vanfleteren, Jan (2014)

Design technology co-optimization for a robust 10nm solution for logic design and Sram

Vandewalle, Boris; Chava, Bharani; Sakhare, Sushil; Ryckaert, Julien; Dusa, Mircea (2014)

Hidden-head-in-pillow soldering failures

Vandevelde, Bart; Willems, Geert; Allaert, Bart (2014)

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Vandevelde, Bart; Labie, Riet; Degrendele, Lieven; Cauwe, Maarten; De Baets, Johan; Willems, Geert (2014-05)

Advanced lithography materials as key scaling enablers

Vandenberghe, Geert; De Simone, Danilo; Gronheid, Roel (2014)

An optical delayline based on excitable microrings

Van Vaerenbergh, Thomas; Fiers, Martin; Dambre, Joni; Bienstman, Peter (2014)

Simulation of nonlinear optical resonator circuits

Van Vaerenbergh, Thomas; Fiers, Martin; Bienstman, Peter; Dambre, Joni (2014)

Cascadable excitability in optically injected microdisk

Van Vaerenbergh, Thomas; Alexander, Koen; Fiers, Martin; Mechet, Pauline; Dambre, Joni; Bienstman, Peter (2014)

III-V on-silicon sources for optical interconnect applications

Van Thourhout, Dries; Keyvaninia, Shahram; Tassaert, Martijn; Spuesens, Thijs; Roelkens, Gunther; Tian, Bin; Wang, Zhechao; Pantouvaki, Marianna; Van Campenhout, Joris; Merckling, Clement (2014-10)

III-V integration on silicon: monolithic or bonding

Van Thourhout, Dries; Keyvaninia, Shahram; Tassaert, Martijn; Spuesens, Thijs; Roelkens, Gunther; Tian, Bin; Wang, Zhechao; Pantouvaki, Marianna; Van Campenhout, Joris; Merckling, Clement (2014)

Impact of ADC clipping and quantization on phase-modulated 79 GHz CMOS radar

Van Thillo, Wim; Giannini, Vito; Guermandi, Davide; Brebels, Steven; Bourdoux, André (2014)

Alternative EUV mask technology for mask 3D effect compensation

Van Look, Lieve; Philipsen, Vicky; Hendrickx, Eric; Vandenberghe, Geert; Knops, Roel; Davydova, Natalia; Wittebrood, Friso; De Kruif, Robert; Van Oosten, Anton; Fliervoet, Timon; Van Schoot, Jan; Neumann, Jens Timo (2014)

A dual-notch +27dBm Tx-power electrical balance duplexer

van Liempd, Barend; Singh, Rishi; Malotaux, Satoshi; Reynaert, Patrick; Long, John; Craninckx, Jan (2014-09)

RF self-interference Cancellation for full duplex

van Liempd, Barend; Lavin, Cristina; Malotaux, Satoshi; van den Broek, Dirk-Jan; Debaillie, Bjorn; Palacios, Carmen; Long, John R.; Klumperink, Erik A.M.; Craninckx, Jan (2014)

Conference contributions: Recent submissions

Cost components for 3D system integration ﻿

Spin torque majority gates: operating conditions and a new design for enhanced reliability ﻿

Interplay between metallization and strain relaxation in epitaxial GeSn layers ﻿

Advanced experimental BEOL stability test: measurements and simulations ﻿

On the impact of dopants and Si structure dimensions on {113}-defect formation during in-situ 2 MeV electron-irradiation in an UHVEM ﻿

Ultra high voltage electron microscoy study of {113}-defect generation in Si nanowires ﻿

Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies ﻿

Design technology co-optimization for a robust 10nm solution for logic design and Sram ﻿

Hidden-head-in-pillow soldering failures ﻿

Reduced 2nd level solder joint life time of low-CTE mold compound packages ﻿

Advanced lithography materials as key scaling enablers ﻿

An optical delayline based on excitable microrings ﻿

Simulation of nonlinear optical resonator circuits ﻿

Cascadable excitability in optically injected microdisk ﻿

III-V on-silicon sources for optical interconnect applications ﻿

III-V integration on silicon: monolithic or bonding ﻿

Impact of ADC clipping and quantization on phase-modulated 79 GHz CMOS radar ﻿

Alternative EUV mask technology for mask 3D effect compensation ﻿

A dual-notch +27dBm Tx-power electrical balance duplexer ﻿

RF self-interference Cancellation for full duplex ﻿