Recently added

Wet thermal oxidation technique for current guiding in membrane lasers

Bhat, S.P.; van der Tol, J.J.G.M.; Roelkens, Gunther; Smalbrugge, E.; Van Veldhoven, P.J.; Ambrosius, H.P.P.M.; Smit, M.K. (2014)

3D interposer technology - challenges and opportunities

Beyne, Eric (2014)

Challenges and opportunities for stacking ICs

Beyne, Eric (2014)

3D integration - definitions, status and roadmap

Beyne, Eric (2014)

3D system integration - mitigating the impact on CMOS devices

Beyne, Eric (2014)

Cost analysis 2.5D and 3D system integration

Beyne, Eric (2014)

Development of a resistive memory-based, radiation-hardened cache memory for space flight and mission-critical applications

Bennett, W.; Hooten, N.; Schrimpf, R.; Reed, R.; Alles, M.; Zhang, E.X.; Weeden-Wright, S.; Jurczak, Gosia; Linten, Dimitri; Fantini, Andrea (2014)

Efficient reliability testing of emerging memory technologies using multiple radiation sources

Bennet, W.G.; Hooten, N.C.; Weeded-Wright, S.; Schrimpf, R.D.; Reed, R.A.; Alles, M.C.; Zhang, E.X.; Mc Curdy, M.W.; Linten, Dimitri; Jurczak, Gosia; Fantini, Andrea (2014)

Origin of the deep reset and low variability of pulse-programmed W\Al2O3\TiW\Cu CBRAM device

Belmonte, Attilio; Degraeve, Robin; Fantini, Andrea; Kim, Woosik; Houssa, Michel; Jurczak, Gosia; Goux, Ludovic (2014)

Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy

Bekaert, Joost; Doise, Jan; MKuppuswamy, Vijaya Kumar; Gronheid, Roel; Chan, BT; Vandenberghe, Geert; Cao, Yi; Her, YoungJun (2014)

Ribbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges

Beaucarne, Guy; Kuzma Filipek, Izabela; Campeol, Frederic; Russell, Richard; Young, Xue Yang; Wei, Jason; Yu, Yanghai; Duerinckx, Filip (2014)

Mitigating mask roughness via pupil filtering

Baylav, Burak; Maloney, Chris; Levinson, Zac; Bekaert, Joost; Vaglio Pret, Alessandro; Smith, Bruce (2014)

NIMBUS: Nmos-based integrated modular bypass for use in solar systems

Bauwens, Pieter; Doutreloigne, Jan (2014)

Low damage cryogenic etching of low-k materials for advanced interconnects

Baklanov, Mikhaïl; Zhang, Liping; de Marneffe, Jean-Francois; Dussart, Remi; Goodyear, Andy (2014)

Characterization of coatings with huge internal surfaces by using ellipsometry

Baklanov, Mikhaïl (2014)

Materials for advanced interconnects

Baklanov, Mikhaïl (2014)

Configurable module topology to recover power lost due to current mismatch

Baka, Maro; Catthoor, Francky; Soudris, D.; Papanikolaou, Antonis (2014)

Resonant enhancement mechanisms in lab-on-chip raman spectroscopy on a silicon nitride waveguide platform

Baets, Roel; Dhakal, Ashim; Peyskens, Frederic; Wuytens, Pieter; Skirtach, Andre; Le Thomas, Nicolas; Subramanian, Ananth (2014)

Spectroscopic sensing enabled by silicon photonics

Baets, Roel (2014)

Impact of traps on the electrical characteristics of GeSn/Ge diodes

Baert, Bruno; Gupta, Somya; Gencarelli, Federica; Loo, Roger; Simoen, Eddy; Nguyen, N.D. (2014-09)

Conference contributions: Recent submissions

Wet thermal oxidation technique for current guiding in membrane lasers ﻿

3D interposer technology - challenges and opportunities ﻿

Challenges and opportunities for stacking ICs ﻿

3D integration - definitions, status and roadmap ﻿

3D system integration - mitigating the impact on CMOS devices ﻿

Cost analysis 2.5D and 3D system integration ﻿

Development of a resistive memory-based, radiation-hardened cache memory for space flight and mission-critical applications ﻿

Efficient reliability testing of emerging memory technologies using multiple radiation sources ﻿

Origin of the deep reset and low variability of pulse-programmed W\Al2O3\TiW\Cu CBRAM device ﻿

Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy ﻿

Ribbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges ﻿

Mitigating mask roughness via pupil filtering ﻿

NIMBUS: Nmos-based integrated modular bypass for use in solar systems ﻿

Low damage cryogenic etching of low-k materials for advanced interconnects ﻿

Characterization of coatings with huge internal surfaces by using ellipsometry ﻿

Materials for advanced interconnects ﻿

Configurable module topology to recover power lost due to current mismatch ﻿

Resonant enhancement mechanisms in lab-on-chip raman spectroscopy on a silicon nitride waveguide platform ﻿

Spectroscopic sensing enabled by silicon photonics ﻿

Impact of traps on the electrical characteristics of GeSn/Ge diodes ﻿

Wet thermal oxidation technique for current guiding in membrane lasers

3D interposer technology - challenges and opportunities

Challenges and opportunities for stacking ICs

3D integration - definitions, status and roadmap

3D system integration - mitigating the impact on CMOS devices

Cost analysis 2.5D and 3D system integration

Development of a resistive memory-based, radiation-hardened cache memory for space flight and mission-critical applications

Efficient reliability testing of emerging memory technologies using multiple radiation sources

Origin of the deep reset and low variability of pulse-programmed W\Al2O3\TiW\Cu CBRAM device

Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy

Ribbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges

Mitigating mask roughness via pupil filtering

NIMBUS: Nmos-based integrated modular bypass for use in solar systems

Low damage cryogenic etching of low-k materials for advanced interconnects

Characterization of coatings with huge internal surfaces by using ellipsometry

Materials for advanced interconnects

Configurable module topology to recover power lost due to current mismatch

Resonant enhancement mechanisms in lab-on-chip raman spectroscopy on a silicon nitride waveguide platform

Spectroscopic sensing enabled by silicon photonics

Impact of traps on the electrical characteristics of GeSn/Ge diodes