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Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
dc.contributor.author | Sun, X. | |
dc.contributor.author | Slabbekoorn, J. | |
dc.contributor.author | Sinha, S. | |
dc.contributor.author | Bex, P. | |
dc.contributor.author | Pinho, N. | |
dc.contributor.author | Webers, T. | |
dc.contributor.author | Velenis, D. | |
dc.contributor.author | Miller, A. | |
dc.contributor.author | Collaert, N. | |
dc.contributor.author | Van der Plas, G. | |
dc.contributor.author | Beyne, E. | |
dc.date.accessioned | 2022-09-17T02:52:06Z | |
dc.date.available | 2022-09-17T02:52:06Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40440 | |
dc.source | WOS | |
dc.title | Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Sun, X. | |
dc.contributor.imecauthor | Slabbekoorn, J. | |
dc.contributor.imecauthor | Sinha, S. | |
dc.contributor.imecauthor | Bex, P. | |
dc.contributor.imecauthor | Pinho, N. | |
dc.contributor.imecauthor | Webers, T. | |
dc.contributor.imecauthor | Velenis, D. | |
dc.contributor.imecauthor | Miller, A. | |
dc.contributor.imecauthor | Collaert, N. | |
dc.contributor.imecauthor | Van der Plas, G. | |
dc.contributor.imecauthor | Beyne, E. | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00009 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 7 | |
dc.source.endpage | 11 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
imec.availability | Under review |
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