TCAD study of latch-up sensitivity to wafer thinning below 500 nm

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dc.contributor.author	Hiblot, Gaspard
dc.contributor.author	Serbulova, Kateryna
dc.contributor.author	Hellings, Geert
dc.contributor.author	Chen, Shih-Hung
dc.date.accessioned	2022-09-25T02:51:36Z
dc.date.available	2022-09-25T02:51:36Z
dc.date.issued	2021
dc.identifier.issn	1545-827X
dc.identifier.other	WOS:000853482700023
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40509
dc.source	WOS
dc.title	TCAD study of latch-up sensitivity to wafer thinning below 500 nm
dc.type	Proceedings paper
dc.contributor.imecauthor	Hiblot, Gaspard
dc.contributor.imecauthor	Serbulova, Kateryna
dc.contributor.imecauthor	Hellings, Geert
dc.contributor.imecauthor	Chen, Shih-Hung
dc.contributor.orcidimec	Hiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimec	Serbulova, Kateryna::0000-0001-7326-9949
dc.contributor.orcidimec	Hellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimec	Chen, Shih-Hung::0000-0002-6481-2951
dc.identifier.doi	10.1109/CAS52836.2021.9604133
dc.identifier.eisbn	978-1-6654-3571-0
dc.source.numberofpages	4
dc.source.peerreview	yes
dc.source.beginpage	121
dc.source.endpage	124
dc.source.conference	44th International Semiconductor Conference (CAS)
dc.source.conferencedate	OCT 06-08, 2021
imec.availability	Under review

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Version	Item	Date	Summary
3	20.500.12860/40509.3	2023-01-19T16:24:31Z	validation by library/open access desk
1	20.500.12860/40509*	2022-09-25T02:51:36Z