Sub-THz III-V on Si technologies for 6G electronics

Abstract

In this work, we will highlight the need for a mature and upscaled III-V technology to address the needs for the power amplifiers in next generation 6G applications, where the vision is to move to operating frequencies above 100GHz. III-V upscaling ultimately allows to enable a hybrid III-V/CMOS technology to reduce power consumption but also enable a much smaller footprint. We will also discuss the possible co-integration schemes to combine these devices with standard CMOS, used for the beamforming, and how to connect to the antennas.