Publication:
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
Loading...
Journal
Abstract
Description
Metrics
Views
1455 since deposited on 2023-01-15
7last month
3last week
Acq. date: 2026-01-09
Citations
Metrics
Views
1455 since deposited on 2023-01-15
7last month
3last week
Acq. date: 2026-01-09
Citations