Publication:
Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallization
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Acq. date: 2026-01-10
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Acq. date: 2026-01-10
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1 since deposited on 2023-04-04
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828 since deposited on 2023-04-04
4last month
2last week
Acq. date: 2026-01-10
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