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Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations

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821 since deposited on 2023-07-15
1last month
Acq. date: 2026-02-25

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821 since deposited on 2023-07-15
1last month
Acq. date: 2026-02-25

Citations