Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages

Publication:

2023

Proceedings Paper

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2023 IEEE 41st VLSI Test Symposium (VTS)

1 since deposited on 2023-07-24

Acq. date: 2026-02-25

1139 since deposited on 2023-07-24

Acq. date: 2026-02-25