Publication:

Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages

Date

2023
Proceedings Paper
https://doi.org/10.1109/VTS56346.2023.10140006
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Published version 5.62 MB

Author(s)

Chuang, Po-Yao  
;
Lorenzelli, Francesco  
;
Chakravarty, Sreejit
;
Wu, Cheng-Wen
;
Gielen, Georges
;
Marinissen, Erik Jan  

Journal

2023 IEEE 41st VLSI Test Symposium (VTS)

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