Notice
This item has not yet been validated by imec staff.
Notice
This is not the latest version of this item. The latest version can be found at: https://imec-publications.be/handle/20.500.12860/42288.2
Reduced resistivity of NiAl by backthinning for advanced interconnect metallization
dc.contributor.author | Soulie, Jean-Philippe | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Adehnann, Christoph | |
dc.date.accessioned | 2023-08-07T17:07:24Z | |
dc.date.available | 2023-08-07T17:07:24Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2380-632X | |
dc.identifier.other | WOS:001027381700053 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42288 | |
dc.source | WOS | |
dc.title | Reduced resistivity of NiAl by backthinning for advanced interconnect metallization | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Soulie, Jean-Philippe | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Adehnann, Christoph | |
dc.contributor.orcidimec | Soulie, Jean-Philippe::0000-0002-5956-6485 | |
dc.identifier.doi | 10.1109/IITC/MAM57687.2023.10154878 | |
dc.identifier.eisbn | 979-8-3503-1097-9 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM) | |
dc.source.conferencedate | MAY 22-25, 2023 | |
dc.source.conferencelocation | Dresden | |
imec.availability | Under review |
Files in this item
Files | Size | Format | View |
---|---|---|---|
There are no files associated with this item. |