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Low temperature SiCN as dielectric for hybrid bonding
dc.contributor.author | Channam, Venkat Sunil Kumar | |
dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | Walsby, Edward | |
dc.contributor.author | Belov, Igor | |
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Sepulveda, Alfonso | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2023-09-03T17:38:49Z | |
dc.date.available | 2023-09-03T17:38:49Z | |
dc.date.issued | 2023 | |
dc.identifier.other | WOS:001004185500104 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42453 | |
dc.source | WOS | |
dc.title | Low temperature SiCN as dielectric for hybrid bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Channam, Venkat Sunil Kumar | |
dc.contributor.imecauthor | Iacovo, Serena | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Sepulveda, Alfonso | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Channam, Venkat Sunil Kumar::0000-0003-2034-4313 | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/EDTM55494.2023.10103036 | |
dc.identifier.eisbn | 979-8-3503-3252-0 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM) | |
dc.source.conferencedate | MAR 07-10, 2023 | |
dc.source.conferencelocation | Seoul | |
imec.availability | Under review |
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