Publication:

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Date

2023
Proceedings Paper
https://doi.org/10.1109/ectc51909.2023.00241
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Author(s)

Iacovo, Serena  
;
D'have, Koen  
;
Okudur, Oguzhan Orkut  
;
De Vos, Joeri  
;
Uhrmann, Thomas
;
Plach, Thomas
;
Conard, Thierry  
;
Meersschaut, Johan  
;
Bex, Pieter  
;
Brems, Steven  
;
Phommahaxay, Alain  
;
Gonzalez, Mario  
;
Witters, Liesbeth  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

na

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