Publication:

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Date

2023

Proceedings Paper

https://doi.org/10.1109/ECTC51909.2023.00241

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Author(s)

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Okudur, Oguzhan Orkut

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Uhrmann, Thomas

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Conard, Thierry

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Meersschaut, Johan

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Phommahaxay, Alain

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Gonzalez, Mario

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Witters, Liesbeth

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Journal

na

Metrics

1087 since deposited on 2023-10-23

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Acq. date: 2025-12-14