Publication:

Process challenges during CVD oxide deposition on the backside of 20-Î¼m thin 300-mm wafers temporarily bonded to glass carriers.

Date

2023

Proceedings Paper

https://doi.org/10.1109/ECTC51909.2023.00269

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Author(s)

;

Guerrero, Alice

;

Salahouelhadj, Abdellah

;

;

Derakhshandeh, Jaber

;

Phommahaxay, Alain

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;

;

Journal

na

Statistics

1006 since deposited on 2023-10-24

Acq. date: 2026-03-01