Publication:

Al3Sc thin films for advanced interconnect applications

Date

2024
Journal article
https://doi.org/10.1016/j.mee.2024.112141
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Published version 4.57 MB
Accepted version 1.25 MB

Author(s)

Soulie, Jean-Philippe  
;
Sankaran, Kiroubanand  
;
Founta, Valeria  
;
Opsomer, Karl  
;
Detavernier, Christophe
;
Van de Vondel, Joris
;
Pourtois, Geoffrey  
;
Tokei, Zsolt  
;
Swerts, Johan  
;
Adelmann, Christoph  

Journal

MICROELECTRONIC ENGINEERING

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21 since deposited on 2024-03-29
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