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Advanced EUV patterning of 2D TMDs for CMOS integration

dc.contributor.authorFaramarzi, Vina
dc.contributor.authorde Poortere, Etienne
dc.contributor.authorVenugopalan, Syam Parayil
dc.contributor.authorWoltgens, Pieter
dc.contributor.authorWoo, Youngtag
dc.contributor.authorvan de Kerkhof, Mark
dc.contributor.authorKumar, Pawan
dc.contributor.authorMedina Silva, Henry
dc.contributor.authorMorin, Pierre
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorDorow, Chelsey
dc.contributor.authorO'Brien, Kevin
dc.contributor.authorMaxey, Kirby
dc.contributor.authorAvci, Uygar
dc.date.accessioned2024-08-19T15:08:03Z
dc.date.available2024-06-06T18:30:28Z
dc.date.available2024-08-19T15:08:03Z
dc.date.issued2024
dc.identifier.isbn978-1-5106-7218-5
dc.identifier.issn0277-786X
dc.identifier.otherWOS:001222851800015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43996.2
dc.sourceWOS
dc.titleAdvanced EUV patterning of 2D TMDs for CMOS integration
dc.typeProceedings paper
dc.contributor.imecauthorKumar, Pawan
dc.contributor.imecauthorMorin, Pierre
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorMedina Silva, Henry
dc.contributor.orcidimecKumar, Pawan::0000-0002-5764-2915
dc.contributor.orcidimecMorin, Pierre::0000-0002-4637-496X
dc.contributor.orcidimecAsselberghs, Inge::0000-0001-8371-3222
dc.contributor.orcidimecMedina Silva, Henry::0000-0003-1461-5703
dc.date.embargo2024-04-09
dc.identifier.doi10.1117/12.3011818
dc.identifier.eisbn978-1-5106-7219-2
dc.source.numberofpages9
dc.source.peerreviewyes
dc.source.beginpage129660I
dc.source.conferenceConference on Novel Patterning Technologies
dc.source.conferencedateFEB 26-29, 2024
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.volume12956
imec.availabilityPublished - open access


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220.500.12860/43996.2*2024-08-19T15:05:07Zvalidation by library/open access desk
120.500.12860/439962024-06-06T18:30:28Z

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