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Articles
Cu1-xAlx films as alternatives to copper for advanced interconnect metallization
Publication:
Cu1-xAlx films as alternatives to copper for advanced interconnect metallization
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Date
2024
Journal article
https://doi.org/10.1116/6.0003634
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Soulie, Jean-Philippe
;
Sankaran, Kiroubanand
;
Pourtois, Geoffrey
;
Swerts, Johan
;
Tokei, Zsolt
;
Adelmann, Christoph
Journal
Journal of vacuum science and technology B
Abstract
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499
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Acq. date: 2026-01-07
Citations
Metrics
Views
499
since deposited on 2024-06-21
22
last month
8
last week
Acq. date: 2026-01-07
Citations