Publication:
Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach
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Acq. date: 2026-07-20
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433 since deposited on 2024-06-23
3last month
3last week
Acq. date: 2026-07-20
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507 since deposited on 2024-06-23
Acq. date: 2026-07-20
Citations