Publication:
Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach
Loading...
Journal
Abstract
Description
Statistics
Downloads
444 since deposited on 2024-06-23
14last month
3last week
Acq. date: 2026-08-11
Views
508 since deposited on 2024-06-23
1last month
Acq. date: 2026-08-11
Citations
Statistics
Downloads
444 since deposited on 2024-06-23
14last month
3last week
Acq. date: 2026-08-11
Views
508 since deposited on 2024-06-23
1last month
Acq. date: 2026-08-11
Citations