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Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

dc.contributor.authorXu, Pengfei
dc.contributor.authorHe, Junwen
dc.contributor.authorKennes, Koen
dc.contributor.authorDvoretskii, Anton
dc.contributor.authorPodpod, Arnita
dc.contributor.authorLepage, Guy
dc.contributor.authorGolshani, Negin
dc.contributor.authorMagdziak, Rafal
dc.contributor.authorBipul, Swetanshu
dc.contributor.authorBode, Dieter
dc.contributor.authorVerheyen, Peter
dc.contributor.authorChakrabarti, Maumita
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorMiller, Andy
dc.contributor.authorBan, Yoojin
dc.contributor.authorFerraro, Filippo
dc.contributor.authorVan Campenhout, Joris
dc.date.accessioned2025-04-17T13:41:21Z
dc.date.available2024-10-17T18:45:10Z
dc.date.available2025-04-17T13:41:21Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-7758-3
dc.identifier.issnN/A
dc.identifier.otherWOS:001242671400322
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44652.2
dc.sourceWOS
dc.titleCollective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer
dc.typeProceedings paper
dc.contributor.imecauthorXu, Pengfei
dc.contributor.imecauthorHe, Junwen
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorDvoretskii, Anton
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorLepage, Guy
dc.contributor.imecauthorGolshani, Negin
dc.contributor.imecauthorMagdziak, Rafal
dc.contributor.imecauthorBipul, Swetanshu
dc.contributor.imecauthorBode, Dieter
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorChakrabarti, Maumita
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorFerraro, Filippo
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecDvoretskii, Anton::0009-0003-0931-1614
dc.contributor.orcidimecPodpod, Arnita::0009-0005-1890-570X
dc.contributor.orcidimecLepage, Guy::0000-0002-3883-4452
dc.contributor.orcidimecGolshani, Negin::0000-0002-1299-0641
dc.contributor.orcidimecMagdziak, Rafal::0009-0007-0378-302X
dc.contributor.orcidimecBipul, Swetanshu::0000-0002-2701-8505
dc.contributor.orcidimecBode, Dieter::0000-0001-5351-285X
dc.contributor.orcidimecVerheyen, Peter::0000-0002-8245-9442
dc.contributor.orcidimecChakrabarti, Maumita::0000-0003-4584-0399
dc.contributor.orcidimecVelenis, Dimitrios::0000-0001-7947-8098
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.contributor.orcidimecFerraro, Filippo::0000-0002-9328-5548
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.identifier.doi10.1364/OFC.2024.Tu3A.4
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceOptical Fiber Communications Conference and Exhibition (OFC)
dc.source.conferencedateMAR 24-28, 2024
dc.source.conferencelocationSan Diego
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThis work was supported by imec's industry-affiliation R&D program "Optical I/O".


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220.500.12860/44652.2*2025-04-17T13:37:00Zvalidation by library/open access desk
120.500.12860/446522024-10-17T18:45:10Z

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