Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Abstract

We present a collective PIC die-to-wafer dielectric bonding process, enabling SiN waveguide-based die-to-wafer evanescent couplers with insertion losses of 0.36 +/- 0.18dB at 1310nm wavelengths, paving the way to optically interconnected 300mm wafer-scale multi-chip compute systems. (c) 2024 The Author(s)